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CP12 prober

 

Item

CP12 prober

Dimension

1620mm(W) *1230D*1450mm(H)

Wafer

200mm,300mm

Wafer thickness

250~2000μm

Die Size

350μm ~76,000μm

Transfer mode

Vacuum suction, dual arms

Accuracy

XY±1.5μmZ±2.5μm

XY platform

Probing area ± 170mm, repeated positioning accuracy ± 1μm

Z axis

Repeated positioning accuracy ± 1.5μm, max speed 30mm/s

Force

50kg (optional 200kg)

Calibration

Image calibration, with high/low–power template

Index time

240ms (based on die size 6mm,Z clearance 0.5mm)

Test temperature

Ambient~150±1

Communication interface

GPIB, reserved TTL and RS232

Option

ID reading, auto card exchange

Refer to the prober for CIS and SOC device.

 

Copyright: Hangzhou ChangChuan Technology Co.,Ltd. Address: No. 410 Jucai Road, Binjiang District, Hangzhou

Tel: +86-571-85096193 Fax: +86-571-88830180 Technical support:

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